Automatic Wafer Handling System for DOA Equipment

  Features  

·With gantry mechanism to load / Unload wafers (or imported six-axis robot to load/unload wafers) and six-axis robot to handle the cassettes; dual work stations for wafer loading/unloading switching to ensure high throughput and stability of the equipment;

·The important parts such as combs and grippers are made of special materials and processing techniques which greatly reduces the damages of the combs/grippers caused to the wafers; the specially designed structures can realize the rapid replacement of a single comb/gripper;

·Modularized control program structure, HMI realizes high-speed data interaction with PLC through network communication, which is convenient for equipment function expansion and maintenance; with user-friendly man-machine interface and perfect detection & alarm system to ensure the automatic and stable operation of the equipment;

·Compatible with MES system / AGV smart production line; sheet resistance detection module & other testing modules are optional; other functions can be customized according to customer's demands.