Automatic Wafer Handling System for PECVD

  Features  

· With modular design,which can inline integrated with one or two sets of PECVD equipment.

· With PC control,tablet computer operation,which is easy and clear for operation.

· Online micro-crack detection,film thickness detection,color inspection system,online CCD wafer warpage detection and automatic dealing with NG wafers(need extra charges).

· Inline/offline configuration.

· Compatible with AGV,RFID system,MES function optional.