Horizontal LPCVD Equipment

  Features  

· Low pressure and hot wall process characteristics, with better film uniformity and good compactness.

· LPCVD process, densely loaded substrates have little effect on the coating rate, with large loading capacity in single tube.

· More temperature zones to ensure the uniformity between wafers reliably.

· Independently adjustable segmented air inlet to compensate for the airflow depletion effect.